Thin Film Material
Sputtering Target
Based on 30 years of accumulated production technology, including alloy design, grain refinement, and crystallographic orientation control of precious and non-ferrous metals, our company has independently developed high-purity sputtering targets used in the semiconductor and optical industries. We supply these products to leading domestic and global companies.
We produce sputtering target products made not only from Au, Ag, Cu, NiCr, and Ti but also from a wide variety of other metal materials. These products are processed and sold in various shapes, including flat, circular, rectangular, and cylindrical forms.
ioeedo TiW Target, Sn Target, SUS Target deung-ui jepum-eul panmaehago issseubnida. sang-gi gyugyeogpumdeul oeui Raw, Purity, hyeongtae, seongneung-eul pil-yolo hasin gogaegbundeulkkeseoneun jeonhwamun-ui balabnida.
114 / 5,000
In addition, we sell products such as TiW Target, Sn Target, and SUS Target. Customers who require Raw, Purity, shape, and performance other than the above standard products, please contact us by phone.
Backing Plate(B/P)
We produce and sell backing plates used in sputtering pillows. In addition to products sold by debugging, we can also produce and sell products customized to the shape or specifications to meet customer conditions.
Bonding
Bonding Material : In, Tin Silver
Bonding method : Bonding, E-Beam
We manufacture and sell reliable targets that use bonding materials that meet the specifications required by our customers and guarantee bonding rates.